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MMBD301
3
DISCRETE POWER AND SIGNAL TECHNOLOGIES CONNECTION DIAGRAM
3
PACKAGE SOT-23 TO-236AB (Low)
1
4T
1 2 NC SOT-23 TO236AB
2
PACKAGE
Schottky Barrier Diode
Sourced from Process GD
Absolute Maximum Ratings* Sym
Tstg TJ Wiv PF
TA = 25OC unless otherwise noted
Parameter
Storage Temperature Operating Junction Temperature Working Inverse Voltage Forward Power Dissipation @ TA = 25OC Derate above 25OC
Value
-55 to +150 -55 to +125 25 200 2.0
Units
OC OC
V mW Mw/OC
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Electrical Characteristics SYM
TA = 25OC unless otherwise noted
CHARACTERISTICS
MIN 30
MAX
UNITS V IR
TEST CONDITIONS = 10 uA 25 V 1.0 mA 10 mA 15 V 1.0 MHz
BV Breakdown Voltage IR Reverse Leakage VF Forward Voltage CT Capacitance
(c) 1997 Fairchild Semiconductor Corporation
200 450 600 1.5
nA mV mV pF
VR = IF = IF = VR = f=
DISCRETE POWER AND SIGNAL TECHNOLOGIES
0.019 (0.483) 0.015 (0.381)
3
0.098 (2.489) 0.083 (2.108)
3 CHARACTERS MAX
0.055 (1.397) 0.047 (1.194)
1
2
0.024 (0.810) 0.018 (0.457)
0.040 (1.016) 0.035 (0.889) 0.080 (2.032) 0.070 (1.778) 0.120 (3.048) 0.110 (2.794)
LOW PROFILE (49)
0.041 (1.041) 0.035 (0.889)
LOW PROFILE (49)
0.0040 (0.102) 0.0005 (0.013)
0.0059 (0.150) 0.0035 (0.089)
SOT-23
TO-236AB (LOW PROFILE)
22-August-1994
DISCRETE POWER AND SIGNAL TECHNOLOGIES
0.030" +/- 0.005" (0.762 +/- 0.127)
0.120" MINIMUM (3.048)
0.035" TYPICAL (0.889)
0.060" +/- 0.005" (1.524 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
SOT-23
DISCRETE POWER AND SIGNAL TECHNOLOGIES
0.031" +/- 0.005" (0.800 +/- 0.127)
0.039" +/- 0.005" (1.000 +/- 0.127)
0.099" +/- 0.005" (2.524 +/- 0.127 )
0.037" +/- 0.005" (0.950 +/- 0.127 )
0.060" +/- 0.005" (1.524 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
U.S. & European SOT-23 & Japanese SC-59
SOT-23 Tape and Reel Data and Package Dimensions
SOT-23 Packaging Configuration: Figure 1. 0
Customized La bel
Packaging Description:
SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a m ultilayer film (Heat Activated Adhesive in na ture) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled pa in standard option are shipped with rts 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color an is made of polystyrene plastic (antid static coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and s ome other options are described in the P ackaging Information table. These full reels are individually labeled and placed inside as tanda intermediate made of recyclable corrugated rd brown pap with a Fairchil d logo printing. One pizza box er contains eight reels maximum. And thes intermediate e boxes are placed inside a labeled shipping box which comes in different sizes depending on t e nu h mber of parts shippe d.
Antistatic Cover Tape
Human Readable Label
Embossed Carrier Tape
3P
SOT-23 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code ) TNR 3,000 7" Dia 187x107x183 24,000 0.0082 0.1175 D87Z TNR 10,000 13" 343x343x64 30,000 0.0082 0.4006
3P
3P
3P
SOT-23 Unit Orientation
343mm x 342mm x 64mm Intermediate box for L87Z Option Human Readable Label
Human Readable Label sample
H uman readable Label
SOT-23 Tape Leader and Trailer Configuration: Figure 2. 0
187mm x 107mm x 183mm Intermediate Box for Stand Option ard
Carrier Tape Cover Tape
Components Trailer Tape 300mm minimum or 75 empty poc kets Leader Tape 500mm minimum or 125 empty pockets
September 1999, Rev. C
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 Embossed Carrier Tape Configuration: Figure 3.0
P0 T E1 P2 D0 D1
F E2 B0 Wc
W
Tc K0
P1
A0
User Direction of Feed
Dimensions are in millimeter Pkg type SOT-23 (8mm)
A0
3.15 +/-0.10
B0
2.77 +/-0.10
W
8.0 +/-0.3
D0
1.55 +/-0.05
D1
1.125 +/-0.125
E1
1.75 +/-0.10
E2
6.25 min
F
3.50 +/-0.05
P1
4.0 +/-0.1
P0
4.0 +/-0.1
K0
1.30 +/-0.10
T
0.228 +/-0.013
Wc
5.2 +/-0.3
Tc
0.06 +/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
SOT-23 Reel Configuration: Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
8mm
Reel Option
7" Dia
Dim A
7.00 177.8 13.00 330
Dim B
0.059 1.5 0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2 0.795 20.2
Dim N
2.165 55 4.00 100
Dim W1
0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0
Dim W2
0.567 14.4 0.567 14.4
Dim W3 (LSL-USL)
0.311 - 0.429 7.9 - 10.9 0.311 - 0.429 7.9 - 10.9
8mm
13" Dia
September 1999, Rev. C
SOT-23 Tape and Reel Data and Package Dimensions, continued
SOT-23 (FS PKG Code 49)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.0082
September 1998, Rev. A1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D

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